As a professional supplier of sputtering targets to the semiconductor, optical coatings, LED, photonics, data storage, wireless, military, and medical industries, high quality bonding service and back plates is also a critical.

Our bonding processes include:

1. Silver Epoxy bonding

2. Solder bonding

3. Other proprietary methods of high-temperature bonding.

Our back plate materials:

1. Oxygen Free Copper (OFHC)

2. Molybdenum Plate

We provide sputtering target bonding services to help customers manage metals for optimal returns. Our technical experts are available to assist customers in identifying the optimal materials solution.